PVA Tepla Corporation wafer internal stress measurement
Non-contact visualization of wafer residual stress, ideal for internal stress monitoring during process development and manufacturing.
The SIRD manufactured by TePla enables non-destructive, non-contact inline monitoring of sample stress fields. A sample subjected to stress exhibits birefringence due to the photoelastic effect. When polarized light passes through the area where birefringence occurs, changes in the polarization state take place. We evaluate the depolarization and transmission at this time to perform imaging of the stress distribution.
- Company：伯東 本社
- Price：Other
